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Profile Details
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USD 150 /hr
Hire Dr. James F.
United States
USD 150 /hr

Materials science/engineering Ph.D. with 8+ years of application-focused R&D experience developing advanced materials

Profile Summary
Subject Matter Expertise
Services
Writing Technical Writing, Creative Writing, General Proofreading & Editing
Research Gap Analysis, Gray Literature Search, Scientific and Technical Research, Systematic Literature Review
Consulting Operations Consulting, Scientific and Technical Consulting, Manufacturing Consulting
Data & AI Data Processing, Data Insights
Product Development Formulation, Recipe Development, Stability/Shelf Life Testing, Product Evaluation, Material Sourcing, Product Validation, Manufacturing, Concept Development, Packaging Design, Prototyping, Reverse Engineering, Device Fabrication
Work Experience

PhD Candidate

Drexel University

- Present

Graduate Research Engineer

Drexel Nanomaterials Institute

January 2026 - January 2026

Polymer Engineer

Arkema

November 2019 - September 2022

Lab Technician

Evonik

June 2018 - November 2019

Procurement Engineer Co-op

Agilent Technologies

April 2017 - September 2017

Product Development Co-op

Crayola

April 2016 - September 2016

Engineering Technician Co-op

Elzly Technology Co.

April 2015 - September 2015

Education

Ph.D, Materials Science and Engineering

Drexel University

September 2022 - June 2026

B.S., Materials Science and Engineering

Drexel University

September 2013 - June 2018

Certifications
  • Certification details not provided.
Publications
JOURNAL ARTICLE
Roman Rakhmanov, Stefano Ippolito, Marley Downes, Alex Inman, Jamal AlHourani, James Fitzpatrick, Yury Gogotsi, Gary Friedman (2025). Influence of MXene Interlayer Spacing on the Interaction with Microwave Radiation . Advanced Functional Materials.
James FitzPatrick, Sumit Bera, Alex Inman, Alessandra Cabrera, Teng Zhang, Tetiana Parker, Bita Soltan Mohammadlou, Iryna Roslyk, Stefano Ippolito, Kateryna Shevchuk, et al. (2025). Record Efficiency of β‐Phase PVDF‐MXene Composites in Thin‐Film Dielectric Capacitors . Advanced Materials.